Shenzhen Vatop Semicon Tech Co.,LTD

139 2576 7787

Argus SL series

Fully automatic 2D and 3D Die bond & Wire bond Optical Inspection Equipment

Argus series AOI is fully automatic 2D and 3D Die bond & Wire bond Optical Inspection Equipment.
Core detection algorithm and optical module are under independent intellectual property rights.
It is applicable to nearly 100 kinds of defects on die surface, die bond, wire bond and frame surface.

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Device Features

Digital, high repeatability, objectivity, high precision, high efficiency, information integration.

Application Field

IC field, power device (IGBT, etc.), SIP, discrete device, COB, optical communication field, lighting LED, miniLED, microLED, lead frame, etc.
  • AOI chip detection scenario

  • IC chip detection interface

  • MEMS chip detection interface

  • LED chip detection interface

Main Features